Manufacturing Capability

Continuous investment in front-end technology has meant that Quick Circuits can take electronic data from its customers in a wide range of formats, process the data and network it direct to the manufacturing plant including automatic optical inspection. As a result of this investment, accuracy direct from CAD data can be achieved for complete manufacturing together with associated benefits such as faster turnaround times and cost savings.
With CAD capabilities becoming more and more sophisticated, Quick Circuits has identified that conventional tooling and manufacturing methods cannot always be relied upon to provide the accuracy required.

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A.O.IElectronic Data Processing
Full Automatic OpticalUcamco Ucam & Graphicode GC-CAM front end software (2 stations)
Inspection to Gerber Data Direct data transfer active 24 hours a day
Formats accepted:Drilling Formats
All Gerber formatsAny ASCII format
ODB++
HPGL
DXF
DPF
Material Types: High SpecificationStandard Specification
FR4, Polyimide, PTFE, High Tg, High Frequency
Max. Circuit Size (Con.PTH) 550x550 550x550
Max. Circuit Size (M/L)550x550457x355
Max. Board Thickness4.84.0
Min. Board Thickness (Conv.PTH)0.10.3
Max. Layer Count3614
Min. Board Thickness (M/L)4L 0.3 0.6
(Min. Multilayer. thickness on request)
Min. Track Width 0.1 0.15
Min. Gap Width 0.13 0.15
Impedance Control+/- 5% +/- 10%
Min. Finished Hole Size
Drilling High SpecificationStandard Specification
0.15 0.3
Max. Aspect Ratio10.0:18.0:1
Min. Annular Ring0.1270.127
Resist Mask High SpecificationStandard Specification
Liquid Photoimageable
Min. solder dam 0.1 0.127
Notation High SpecificationStandard Specification
Standard White/Yellow (Min. line width)0.1270.127
Other colours on request
Photoimageable available
Surface High SpecificationStandard Specification
H.A.S.L.
Electroless Nickel/ Immersion Gold0.030 - 0.100 µm gold over 3 - 6 µm nickel0.030 - 0.100 µm gold over 3 - 6 µm nickel
Silver
Immersion Tin
Electrolytic Hard Gold over Nickel1 -5 µm gold over 3 - 5 µm nickel1 -5 µm gold over 3 - 5 µm nickel
Pure Gold (Wirebonding)
Carbon Ink
Peelable Solder Resist
Bare Board Testing High SpecificationStandard Specification
Flying Probe Testing (3 machines)
Min. pitch0.10.2
Testing to Gerber data
Single Board Testing
Impedance Testing
Using Time Domain Reflectrometry
Technologies
Impedance Control
Blind/Buried Vias
Hole Plugging with ink
High Aspect Ratio Plating
HDI
Sequential Build up Technology
Epoxy Resin Plugging
All capability values are design dependant and subject to receiving data.

Electronic Assembly - The Complete Service

PCB assembly of prototypes through to medium batch production - specialising in high density surface mount assembly. The assembly line is fully automated and caters for a varied range of printed circuit boards from prototypes to medium batch production runs. The culture of Quick Circuits board manufacture is reflected within the assembly division, and turnarounds vary from 24 hours.

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